Technology for sintering powder compacts using laser as a heat source. This technology has unique advantages for sintered materials that are not easily completed by conventional sintering furnaces. Due to the small concentration and penetration of the laser beam, it is suitable for sintering small-area, thin-layer products. It is easy to sinter powder or flake compacts different from the matrix composition.
The use of laser sintering for electronic manufacturing has become a feasible solution in many different industries. By providing suitable tools quickly, economic benefits can be promoted. If the complexity of the required tools is high, this technology will show its advantages.
|Device Positioning Accuracy||≤±0.003mm|
|Minimum Oxygen Content||≤100ppm|
|Molding Atmosphere||N2 Or Ar Protection Gas Consumption ≤ 2L / Min (During Molding) Soot Recovery System|
|Molding Material||Cobalt Chromium Alloy, Titanium Alloy, Stainless Steel, Mold Steel, Aluminum Alloy, Copper Alloy And Other Metal Powders|
|Recommended Installation Space Size||3200mmx2500mmx2500mm(Lxwxh)|
|Power And Power Consumption||220V 5Kw|
The laser can be used to achieve the bonding of high melting point metals and ceramics. Compared with other rapid prototyping technologies, laser sintered parts have good performance, fast production speed, diversified materials and low cost.